[EU] Chips Joint Undertaking Calls on Skills Launched
The Chips Joint Undertaking has launched three calls to bridge the talent gap in semiconductors, to provide qualified and updated education for students and to re- and up-skill the current workforce, under the Chips for Europe Initiative.
The Chips for Europe Initiative aims to support technological capacity building and innovation by bridging the gap between the EU’s advanced research and innovation capabilities and their industrial exploitation. To reinforce skills in the semiconductor industry, the Chips for Europe Initiative aims to increase the visibility and attractiveness of the semiconductor sector and support the development of higher education and vocational training networks.
The calls launched by the Chips Joint Undertaking are funded by the Digital Europe Programme, the EU’s Programme aimed at providing strategic funding for projects in areas such as supercomputing, artificial intelligence, cybersecurity, advanced digital skills, and ensuring a wide use of digital technologies across the economy and society. The 2025-2027 Work Programme highlights key initiatives to be funded, including those related to advanced digital skills.
Key aspects of the three calls launched by the Chips Joint Undertaking include:
- Skills Hubs of Excellence: This call funds the creation of specialised academic "Hubs of Excellence" in critical semiconductor technology areas (e.g. chip design, manufacturing, photonics, power electronics). Projects should build industry-aligned Bachelor, Master, and PhD programmes.
- Pilot Federation: this call supports the establishment of a European-level federation of Vocational Education and Training (VET) providers focused on semiconductor industry roles. Projects should develop industry-aligned micro-credentials and reskilling programmes, with a strong emphasis on workers transitioning from other industrial sectors and on cross-border recognition of qualifications.
- Stimulation of Chip Design: this call funds a comprehensive Chip Design Skills Programme to lower barriers to entry in chip design and tape-outs. At least 60% of the budget must support hands-on tape-out experiences (via multi-project wafers) for university and secondary school students.
The calls for proposals close on 24 September 2026.
Key Links and Documents:
- Annex 8, section 5.3.3 of the Chips Joint Undertaking Work Programme provides information on the context, expected outcomes, scope and consortia composition.
- The Guide for Applicants provides information related to the application process.
- Proposals should be submitted by 24 September 2026, 17:00 CET, on the EU Funding & Tenders Portal, respectively:
More information on the Digital Europe Programme and its current priorities can be found in the 2025-2027 Work Programme.
Interested?
If you have any questions about the calls for proposals and the corresponding application processes, or if you are considering applying, please contact Team EU International Education Projects (University Service Education and Research – Function Domain Internationalisation) via eu-educationprojects@ugent.be.
14 juli 2026 13:13